Processing of Epi-Wafer and Fabrication of 976nm Laser Chips and Packaging

Timeline

1. Published1 Oct 2026
   5:10 pm
2. Closes15 Oct 2026
   2:00 pm
3. Bid opening16 Oct 2026
   2:30 pm

Key figures

About this tender

Reference

SSPL/MMG/DPP/SBM/B/R/26-27/094

Tender ID

2026_DRDO_792120_1

Bid type

Single

Product category

Miscellaneous Services

Organisation type

Central Govt. Ministry/Department

Location

SSPL, DELHI

Portal

eProcure

Inviting authority

KUNAL BHUSHAN, SR. STORES OFFICER-II

Fees & money

EMD

₹3 L

Tender fee

None

Important dates

Published

1 Oct 2026, 5:10 pm IST

Closes

15 Oct 2026, 2:00 pm IST

Bid opening

16 Oct 2026, 2:30 pm IST

Similar open tenders

• Engagement of an Agency for collecting the data to draft the National Policy on Bio-packa…
  Council of Scientific and Industrial Research · Closes 14 Oct 2026
• E2563037 FABRICATION OF TRANSITION PIECE
  Bharat Heavy Electricals Limited · Closes 9 Oct 2026
• 2D Broadband Seismic and Gravity Magnetic Data Acquisition Processing and Interpretation…
  Directorate General of Hydrocarbons · Closes 26 Oct 2026
• Re Processing and Interpretation of Legacy 2D and 3D Seismic Data and 3D Broadband Seismi…
  Directorate General of Hydrocarbons · Closes 27 Oct 2026
• Re Processing and Interpretation of Legacy 2D and 3D Seismic Data and 3D Broadband Seismi…
  Directorate General of Hydrocarbons · Closes 27 Oct 2026
• Re Processing and Interpretation of Legacy 2D and 3D Seismic Data and 3D Broadband Seismi…
  Directorate General of Hydrocarbons · Closes 27 Oct 2026
• Re Processing and Interpretation of Legacy 2D and 3D Seismic Data and 3D Broadband Seismi…
  Directorate General of Hydrocarbons · Closes 27 Oct 2026
• 2D Broadband Seismic and Gravity Magnetic Data Acquisition, Processing and Interpretation…
  Directorate General of Hydrocarbons · Closes 26 Oct 2026